028-2008-000239

Technical Characteristics

• Accommodated Contact Quantity

  3

• Precious Material

  gold

• Precious Material And Weight

  0.015 gold grains, troy

• Specific Equipment Accommodated

  semiconductor device

• Mounting Hole Style

  round, body

• Contact Material

  copper alloy

• Terminal Type And Quantity

  3 solder stud

• Contact Surface Treatment

  gold

• Precious Material And Location

  contact surfaces gold

• Body Mounting Hole Accommodation Diameter

  0.290 inches nominal

• Body Material

  plastic

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded

• Contact Position Arrangement Style

  triangular