ROM/PROM

Technical Characteristics

• Body Width

  0.296 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Inclosure Configuration

  leadless flat pack

• Word Quantity

  4096

• Terminal Surface Treatment

  solder

• Memory Device Type

  prom

• Body Length

  0.435 inches maximum

• Body Height

  0.080 inches maximum

• Maximum Power Dissipation Rating

  1.2 watts

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Features Provided

  monolithic and static operation

• Inclosure Material

  metal or ceramic or plastic

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Input Circuit Pattern

  20 input

• Bit Quantity

  16384

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Test Data Document

  96906-mil-std-883 standard

• Terminal Type And Quantity

  20 leadless