CDR31BP100BFUP

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Terminal Length

  0.3 millimeters minimum and 0.7 millimeters maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Overall Length

  1.8 millimeters minimum and 2.7 millimeters maximum

• Dissipation Factor At Reference Temp In Percent

  0.150

• Body Width

  1.0 millimeters minimum and 1.7 millimeters maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Height

  1.1 millimeters minimum and 1.8 millimeters maximum

• Terminal Surface Treatment

  solder

• Capacitance Value Per Section

  10.000 picofarads single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Reliability Indicator

  established

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Reliability Failure Rate Level In Percent

  0.001

• Body Length

  1.8 millimeters minimum and 2.7 millimeters maximum

• Terminal Type And Quantity

  2 bonding pad

• Overall Height

  1.1 millimeters minimum and 1.8 millimeters maximum

• Case Material

  ceramic

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Specification/Standard Data

  81349-mil-c-55681/7 government specification

• Body Style

  chip type

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Overall Width

  1.0 millimeters minimum and 1.7 millimeters maximum