8080-1G4

Technical Characteristics

• Distance Between Mounting Facility Centers

  1.187 inches nominal

• Mounting Hole Style

  two mounting holes/slots, in-line

• Accommodated Contact Quantity

  2

• Mounting Hole Diameter

  0.156 inches nominal

• Overall Width

  0.730 inches maximum

• Body Material

  plastic

• Thread Class

  2a

• Ground Terminal Type And Quantity

  1 tab, solder lug

• Contact Surface Treatment

  silver

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded

• Thread Series Designator

  unc

• Contact Position Arrangement Style

  in line

• Precious Material

  silver

• Thread Quantity Per Inch

  32

• Overall Height

  0.716 inches maximum

• Specific Equipment Accommodated

  semiconductor device

• Projection Length Below Mounting Surface

  0.028 inches nominal

• Body Style

  wafer type

• Nominal Thread Size

  0.138 inches

• Saddle Material

  brass

• Thread Direction

  right-hand

• Mounting Method

  saddle

• Saddle Surface Treatment

  any acceptable

• Precious Material And Location

  contact surfaces silver

• Terminal Type And Quantity

  2 tab, solder lug

• Precious Material And Weight

  0.015 silver grains, troy

• Overall Length

  1.570 inches maximum

• Contact Material

  beryllium copper