RM7566

Technical Characteristics

• Inclosure Configuration

  flat pack

• Time Rating Per Chacteristic

  17.00 nanoseconds maximum propagation delay time, low to high level output and 20.00 nanoseconds maximum propagation delay time, high to low level output

• Storage Temp Range

  -65.0/+200.0 deg celsius

• Input Circuit Pattern

  quad 2 input

• Body Width

  0.265 inches maximum

• Features Provided

  hermetically sealed and monolithic and positive outputs

• Inclosure Material

  ceramic

• Design Function And Quantity

  4 gate, nand-nor

• Body Length

  0.265 inches maximum

• Body Height

  0.030 inches minimum and 0.080 inches maximum

• Operating Temp Range

  +0.0/+75.0 deg celsius

• Test Data Document

  05869-717310-49 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Output Logic Form

  transistor-transistor logic

• Maximum Power Dissipation Rating

  88.0 milliwatts