472-0263-001

Semiconductor Devices and Associated Hardware

SEMICONDUCTOR DEVICE,THYRISTOR

472-0263-001

5961-00-057-4801

5961 - Semiconductor Devices and Associated Hardware

Boeing Company The

SEMICONDUCTOR DEVICE,THYRISTOR

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Technical Characteristics

  • Inclosure Material

    metal

  • Internal Configuration

    junction contact

  • Mounting Method

    terminal

  • Transfer Ratio

    30.0 minimum static forward current transfer ratio, common-emitter and 120.0 maximum static forward current transfer ratio, common-emitter

  • Special Features

    junction pattern arrangement: npn

  • Terminal Type And Quantity

    3 uninsulated wire lead

  • Voltage Rating In Volts Per Characteristic

    160.0 maximum breakdown voltage, collector-to-base, emitter open and 4.0 maximum emitter to base voltage, static, collector open and 140.0 maximum breakdown voltage, collector-to-emitter, base open

  • Semiconductor Material

    silicon

  • Features Provided

    hermetically sealed case

  • Terminal Circle Diameter

    0.200 inches nominal

  • Electrode Internally-Electrically Connected To Case

    anode

  • Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

    to-9

  • Overall Diameter

    0.370 inches maximum

  • Terminal Length

    0.500 inches minimum

  • Overall Length

    0.260 inches maximum

Certified to
AS6081 Methods

Implementing Quality Procurement

A rigorous vendor selection process and vendor management system are essential to ensuring quality.
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Supplying Quality Products

We take every measure to ensure that we supply quality, authentic parts including a strict vendor selection process and rigorous product inspections..
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Providing Quality People

Our team of dedicated account managers, procurement professionals and specialized inspectors is the most valuable resource we have.
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