EFX503K75S1

Technical Characteristics

• Insulation Resistance At Reference Temp

  20000.0 megohm-microfarads

• Center To Center Distance Between Terminals Parallel To Length

  4.063 inches nominal

• Unthreaded Mounting Hole Diameter

  0.196 inches nominal

• Test Data Document

  12217-1145019+4 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Capacitance Value Per Section

  50000.000 picofarads single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Distance Between Centerlines Of Mounting Facilities Parallel To Body Width

  1.188 inches nominal

• Overall Width (Non-Core)

  1.688 inches nominal

• Terminal Type And Quantity

  2 solder stud

• Mounting Facility Type And Quantity

  4 unthreaded mounting holes

• Distance Between Centerlines Of Mounting Facilities Parallel To Body Length

  4.063 inches nominal

• Overall Height (Non-Core)

  1.690 inches nominal

• Terminal Length

  0.313 inches minimum

• Case Material

  plastic

• Body Width

  1.688 inches nominal

• Overall Length (Non-Core)

  3.562 inches nominal

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Body Length

  3.562 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  7500.0 dc single section

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Body Height

  1.690 inches nominal

• Body Style

  w/mtg tabs/flanges, terminal(s) on one surface

• Schematic Diagram Designator

  no common or grounded electrode(s)