43300-8

Technical Characteristics

• Test Data Document

  96214-531452-8 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Dissipation Factor At Reference Temp In Percent

  2.500

• Capacitance Value Per Section

  39.000 picofarads single section

• Overall Height (Non-Core)

  0.150 inches nominal

• Precious Material (Non-Core)

  gold

• Body Style

  chip type

• Overall Width (Non-Core)

  0.150 inches nominal

• Terminal Length

  0.150 inches nominal

• Case Material

  ceramic

• Precious Material And Location

  terminal surfaces gold

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 150.0 deg celsius maximum

• Terminal Type And Quantity

  2 bonding pad

• Overall Length (Non-Core)

  0.031 inches nominal

• Body Length

  0.031 inches nominal

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  -750.0 single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Insulation Resistance At Reference Temp

  10000.0 megohms

• Tolerance Range Per Section

  -20.00/+20.00 percent single section

• Body Diameter

  0.150 inches nominal

• Nonderated Continuous Voltage Rating And Type Per Section

  25.0 dc single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -100.0/+100.0 single section