RM709T

Technical Characteristics

• Case Outline Source And Designator

  t0-99 joint electron device engineering council

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Material

  glass and metal

• Input Circuit Pattern

  4 input

• Body Outside Diameter

  0.335 inches minimum and 0.370 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Terminal Surface Treatment

  solder

• Inclosure Configuration

  can

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Features Provided

  low level and positive outputs and negative outputs and low power and high gain and monolithic and hermetically sealed and externally compensated

• Time Rating Per Chacteristic

  1000.00 nanoseconds maximum propagation delay time, low to high level output

• Body Height

  0.165 inches minimum and 0.185 inches maximum