8300-002C0G509C

Technical Characteristics

• Overall Length

  0.080 inches minimum and 0.100 inches maximum

• Dissipation Factor At Reference Temp In Percent

  2.0000

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Body Width

  0.080 inches minimum and 0.100 inches maximum

• Insulation Resistance At Reference Temp

  2500.0 megohm-microfarads

• Tolerance Range Per Section

  -0.25/+0.25 picofarads single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Height

  0.004 inches minimum and 0.025 inches maximum

• Reliability Indicator

  not established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Capacitance Value Per Section

  5.000 picofarads single section

• Body Length

  0.080 inches minimum and 0.100 inches maximum

• Precious Material And Location

  terminals silver

• Terminal Type And Quantity

  2 bonding pad

• Terminal Surface Treatment

  silver

• Overall Width

  0.080 inches minimum and 0.100 inches maximum

• Overall Height

  0.004 inches minimum and 0.025 inches maximum

• Case Material

  ceramic

• Precious Material (Non-Core)

  silver

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Body Style

  chip type

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section