8058-1G55

Technical Characteristics

• Contact Material

  beryllium copper

• Contact Surface Treatment

  gold and nickel

• Accommodated Contact Quantity

  12

• Capacitance In Picofarads

  1.0 and b0.750

• Printed Circuit Board Hole Arrangement Style

  twelve hole

• Body Material

  plastic

• Overall Height

  0.562 inches nominal

• Contact Resistance In Ohms

  0.009

• Specific Equipment Accommodated

  semiconductor

• Contact Maximum Current Rating In Amps

  1.0

• Polarization Type

  slot

• Projection Length Above Mounting Surface

  0.047 inches nominal

• Mounting Type For Which Designed

  printed circuit

• Precious Material And Weight

  0.012 gold grains,troy

• Precious Material

  gold

• Body Style

  top mount,press fit

• Fabrication Method

  molded

• Temp Rating

  m65.0 deg celsius and 150.0 deg celsius

• Terminal Length

  0.286 inches minimum and 0.348 inches maximum

• Overall Diameter

  0.390 inches minimum and 0.410 inches maximum

• Mounting Method

  terminal

• Contact Position Arrangement Style

  circular

• Precious Material And Location

  contact surfaces gold

• Terminal Type And Quantity

  12 printed circuit