4-25099P

Technical Characteristics

• Inclosure Configuration

  flat pack

• Body Width

  0.200 inches minimum and 0.300 inches maximum

• Precious Material

  gold

• Precious Material And Location

  terminals gold

• Body Length

  0.300 inches minimum and 0.400 inches maximum

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Case Outline Source And Designator

  -0-004-ag joint electron device engineering council

• Test Data Document

  91417-117878 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Inclosure Material

  ceramic and glass

• Input Circuit Pattern

  hex 1 input

• Time Rating Per Chacteristic

  80.00 nanoseconds maximum propagation delay time, low to high level output and 55.00 nanoseconds maximum propagation delay time, high to low level output

• Design Function And Quantity

  6 buffer, inverting and 6 converter, logic level

• Body Height

  0.008 inches minimum and 0.100 inches maximum

• Features Provided

  hermetically sealed and positive outputs and monolithic and medium speed

• Operating Temp Range

  -55.0/+125.0 deg celsius