HSD500

Technical Characteristics

• Inclosure Configuration

  dual-in-line

• Body Width

  0.310 inches maximum

• Time Rating Per Chacteristic

  750.00 nanoseconds maximum propagation delay time, low to high level output and 500.00 nanoseconds maximum propagation delay time, high to low level output

• Features Provided

  monolithic and burn in and hermetically sealed and high power and high speed and positive outputs

• Output Logic Form

  transistor-transistor logic

• Inclosure Material

  ceramic and glass

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Terminal Surface Treatment

  solder

• Overall Height

  0.400 inches maximum

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Overall Width

  0.320 inches maximum

• Body Length

  0.785 inches maximum

• Overall Length

  0.785 inches maximum

• Body Height

  0.185 inches maximum

• Input Circuit Pattern

  quad 2 input

• Terminal Type And Quantity

  14 printed circuit

• Design Function And Quantity

  4 driver, power

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Maximum Power Dissipation Rating

  1.5 watts