8058-1089

Technical Characteristics

• Precious Material

  gold

• Specific Equipment Accommodated

  semiconductor device

• Contact Material

  copper alloy

• Terminal Type And Quantity

  8 tab, solder lug

• Contact Position Arrangement Style

  circular

• Precious Material And Weight

  0.008 gold grains, troy

• Polarization Type

  contact size

• Accommodated Contact Quantity

  8

• Contact Surface Treatment

  gold

• Precious Material And Location

  contact surfaces gold

• Mounting Hole Style

  round, w/keyway

• Body Mounting Hole Accommodation Diameter

  0.375 inches nominal

• Body Material

  plastic

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded