MILS19500-251

Semiconductor Devices and Associated Hardware

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MILS19500-251

5961-00-406-3074

5961 - Semiconductor Devices and Associated Hardware

Military Specifications

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Technical Characteristics

  • Internal Configuration

    junction contact

  • Special Features

    junction pattern arrangement: npn

  • Features Provided

    hermetically sealed case

  • Semiconductor Material

    silicon

  • Terminal Length

    0.500 inches minimum

  • Maximum Operating Temp Per Measurement Point

    200.0 deg celsius junction

  • Current Rating Per Characteristic

    800.00 milliamperes source cutoff current maximum

  • Inclosure Material

    metal

  • Specification/Standard Data

    81349-mil-s-19500/251 government specification

  • Test Data Document

    81349-mil-s-19500 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

  • Overall Length

    0.260 inches maximum

  • Overall Diameter

    0.370 inches maximum

  • Voltage Rating In Volts Per Characteristic

    50.0 maximum breakdown voltage, collector-to-emitter, base open and 75.0 maximum breakdown voltage, collector-to-base, emitter open and 6.0 maximum breakdown voltage, emitter-to-base, collector open

  • ~1

    data on certain environmental and performanc

  • Electrode Internally-Electrically Connected To Case

    collector

  • Terminal Type And Quantity

    3 uninsulated wire lead

  • Mounting Method

    terminal

  • Terminal Circle Diameter

    0.200 inches nominal

  • Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

    t0-39

  • Transfer Ratio

    50.0 maximum static forward current transfer ratio, common-emitter

  • Power Rating Per Characteristic

    3.0 watts small-signal input power, common-collector preset

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