RM30-069

Technical Characteristics

• Voltage Rating And Type Per Characteristic

  25.0 volts maximum power source

• Memory Device Type

  diode matrix

• Body Height

  0.030 inches minimum and 0.070 inches maximum

• Inclosure Material

  ceramic and glass

• Time Rating Per Chacteristic

  10.00 nanoseconds maximum propagation delay time, low to high level output

• Maximum Power Dissipation Rating

  450.0 milliwatts

• Case Outline Source And Designator

  t0-86 joint electron device engineering council

• Test Data Document

  94990-12-37300b drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Output Logic Form

  current-mode logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Inclosure Configuration

  flat pack

• Body Width

  0.240 inches minimum and 0.260 inches maximum

• Input Circuit Pattern

  8 input

• Features Provided

  programmable and positive outputs and monolithic and hermetically sealed and programmed

• Terminal Type And Quantity

  14 flat leads

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Length

  0.240 inches minimum and 0.260 inches maximum

• Terminal Surface Treatment

  solder