QB777HM

Technical Characteristics

• Body Height

  0.165 inches minimum and 0.185 inches maximum

• Input Circuit Pattern

  2 input

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Inclosure Configuration

  can

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  300.00 nanoseconds nominal propagation delay time, low to high level output

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Test Data Document

  96906-mil-std-883 standard (includes industry or association standards, individual manufactureer standards, etc.).

• Body Outside Diameter

  0.335 inches minimum and 0.370 inches maximum

• Features Provided

  hermetically sealed and monolithic and negative outputs and positive outputs

• Inclosure Material

  glass and metal

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Case Outline Source And Designator

  t0-99 joint electron device engineering council