909RFM/C

Technical Characteristics

• Maximum Power Dissipation Rating

  240.0 milliwatts

• Inclosure Material

  ceramic and glass

• Body Height

  0.030 inches minimum and 0.070 inches maximum

• Features Provided

  synchronous and w/clear and monolithic and w/enable and w/buffered output and positive outputs

• Body Length

  0.240 inches minimum and 0.275 inches maximum

• Terminal Surface Treatment

  solder

• Design Function And Quantity

  2 flip-flop, j-k, clocked and 2 flip-flop, j-k, master slave

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Terminal Type And Quantity

  14 flat leads

• Output Logic Form

  diode-transistor logic

• Body Width

  0.240 inches minimum and 0.260 inches maximum

• Inclosure Configuration

  flat pack

• Voltage Rating And Type Per Characteristic

  -1.5 volts minimum power source and 5.5 volts maximum power source

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Input Circuit Pattern

  dual 4 input

• Case Outline Source And Designator

  t0-86 joint electron device engineering council