SES-363
Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,THYRISTOR
SES-363
5961 - Semiconductor Devices and Associated Hardware
SEMICONDUCTOR DEVICE,THYRISTOR
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Technical Characteristics
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Internal Configuration
junction contact
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Overall Width Across Flats
0.544 inches minimum and 0.562 inches maximum
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Features Provided
hermetically sealed case
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Semiconductor Material
silicon
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Overall Height
0.330 inches minimum and 0.505 inches maximum
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Special Features
junction pattern arrangement: pnpn
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Terminal Type And Quantity
1 solder stud and 1 tab, solder lug
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Maximum Operating Temp Per Measurement Point
125.0 deg celsius case
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