283-0093-00

Technical Characteristics

• Body Height

  0.009 inches nominal

• Body Style

  chip type

• Overall Height (Non-Core)

  0.009 inches nominal

• Terminal Type And Quantity

  2 bonding pad

• Overall Length (Non-Core)

  0.128 inches nominal

• Case Material

  plastic

• Capacitance Value Per Section

  15.000 picofarads single section

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Body Length

  0.128 inches nominal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Overall Width (Non-Core)

  0.128 inches nominal

• Body Width

  0.128 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)