RX3070

Technical Characteristics

• Body Length

  0.240 inches minimum and 0.275 inches maximum

• Maximum Power Dissipation Rating

  40.0 milliwatts

• Storage Temp Range

  -65.0 to 150.0 deg celsius

• Inclosure Configuration

  flat pack

• Input Circuit Pattern

  dual 2 wide 2 input

• Case Outline Source And Designator

  t0-85 joint electron device engineering council

• Test Data Document

  95542-161-165 drawing

• Body Width

  0.160 inches minimum and 0.185 inches maximum

• Body Height

  0.030 inches minimum and 0.070 inches maximum

• Operating Temp Range

  -55.0 to 125.0 deg celsius

• Features Provided

  monolithic and hermetically sealed and positive outputs and medium speed and expandable

• Inclosure Material

  ceramic and glass

• Output Logic Form

  transistor-transistor logic

• Design Function And Quantity

  2 gate, and-nor

• Terminal Surface Treatment

  solder

• Voltage Rating And Type Per Characteristic

  -1.5 volts minimum power source and 5.5 volts maximum power source

• Terminal Type And Quantity

  14 flat leads