DMS 82012B

Technical Characteristics

• Body Height

  0.165 inches minimum and 0.185 inches maximum

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Inclosure Configuration

  can

• Terminal Surface Treatment

  solder

• Design Function And Quantity

  1 buffer, inverting

• Terminal Type And Quantity

  8 pin

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Outside Diameter

  0.335 inches minimum and 0.370 inches maximum

• Time Rating Per Chacteristic

  30.00 nanoseconds maximum propagation delay time, low to high level output and 30.00 nanoseconds maximum propagation delay time, high to low level output

• Inclosure Material

  glass and metal

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Case Outline Source And Designator

  t0-99 joint electron device engineering council

• Input Circuit Pattern

  3 input

• Output Logic Form

  resistor-transistor logic

• Features Provided

  hermetically sealed and w/buffered output and negative outputs and monolithic and positive outputs

• Voltage Rating And Type Per Characteristic

  -4.0 volts minimum power source and 4.0 volts maximum power source