8300-006C0G0-820J

Technical Characteristics

• Body Length

  0.300 inches maximum

• Dissipation Factor At Reference Temp In Percent

  2.500

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Quality Factor At Reference Temp

  2.500

• Body Height

  0.025 inches maximum

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Overall Height (Non-Core)

  0.025 inches maximum

• Body Width

  0.300 inches maximum

• Reliability Indicator

  not established

• Terminal Surface Treatment

  solder

• Insulation Resistance At Reference Temp

  1000.0 megohm-microfarads

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Terminal Type And Quantity

  2 bonding pad

• Capacitance Value Per Section

  82.000 picofarads single section

• Tolerance Range Per Section

  -5.00/+5.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Case Material

  ceramic

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Overall Width (Non-Core)

  0.300 inches maximum

• Body Style

  chip type

• Overall Length (Non-Core)

  0.300 inches maximum