CP1B1FG504

Technical Characteristics

• Test Data Document

  81349-mil-c-25 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

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  data on certain environmental and performance r

• Insulation Resistance At Reference Temp

  1500.0 megohm-microfarads

• Body Width

  0.625 inches nominal

• Overall Width (Non-Core)

  0.625 inches nominal

• Case Material

  metal

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Overall Height (Non-Core)

  3.281 inches maximum

• Features Provided

  hermetically sealed case

• Dissipation Factor At Reference Temp In Percent

  1.0000

• Body Style

  w/o mtg facilities, terminal(s) on one surface

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Terminal Type And Quantity

  2 tab, solder lug

• Nonderated Continuous Voltage Rating And Type Per Section

  1000.0 dc single section

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Capacitance Value Per Section

  0.500 microfarads single section

• Body Length

  1.312 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  15.0 megohm-microfarads

• Overall Length (Non-Core)

  1.312 inches nominal

• Body Height

  2.500 inches nominal