CP55B1EG254K

Technical Characteristics

• Overall Height (Non-Core)

  1.687 inches maximum

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 85.0 deg celsius maximum

• Body Width

  1.000 inches nominal

• Distance Between Centerlines Of Mounting Facilities Parallel To Body Length

  2.125 inches nominal

• Features Provided

  hermetically sealed case

• Dissipation Factor At Reference Temp In Percent

  1.0000

• Body Length

  1.812 inches nominal

• Insulation Resistance At Reference Temp

  6000.0 megohms

• ~1

  data on certain environmental and performance r

• Case Material

  metal

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Terminal Type And Quantity

  2 tab, solder lug

• Nonderated Continuous Voltage Rating And Type Per Section

  1000.0 dc single section

• Body Style

  w/mtg tabs/flanges terminal(s) on one surface

• Mounting Facility Type And Quantity

  2 unthreaded mounting holes

• Unthreaded Mounting Hole Diameter

  0.188 inches nominal

• Tolerance Range Per Section

  -10.00/+10.00 percent single section

• Overall Length (Non-Core)

  2.500 inches nominal

• Overall Width (Non-Core)

  1.000 inches nominal

• Insulation Resistance At Maximum Operating Temp

  20.0 megohm-microfarads

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Capacitance Value Per Section

  0.250 microfarads single section

• Body Height

  0.875 inches nominal

• Test Data Document

  81349-mil-c-25 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type