22-11

Technical Characteristics

• Mounting Type For Which Designed

  chassis

• Body Style

  top mount

• Precious Material

  gold and silver

• Temp Rating

  -65.0 deg celsius and 135.0 deg celsius

• Mounting Hole Style

  two mounting holes/slots, in-line

• Contact Material

  beryllium copper

• Terminal Type And Quantity

  4 tab, solder lug

• Distance Between Mounting Facility Centers

  0.560 inches minimum and 0.580 inches maximum

• Contact Position Arrangement Style

  rectangular

• Overall Length

  0.730 inches minimum and 0.770 inches maximum

• Mounting Method

  body through hole

• Body Diameter

  0.330 nominal mils and 0.370 nominal centimeters

• Mounting Hole Diameter

  0.090 nominal mils and 0.100 nominal centimeters

• Precious Material And Weight

  0.020 gold grains, troy and 0.020 silver grains, troy

• Specific Equipment Accommodated

  semiconductor device

• Body Material

  ceramic

• Polarization Type

  contact position

• Accommodated Contact Quantity

  4

• Contact Surface Treatment

  gold and silver

• Precious Material And Location

  contact surfaces gold and contact surfaces silver

• Contact Resistance In Ohms

  0.050

• Fabrication Method

  molded