05-3303 00 00 000

Technical Characteristics

• Specific Equipment Accommodated

  semiconductor device

• Overall Diameter

  0.354 inches nominal

• Precious Material And Weight

  0.004 gold grains, troy and 0.004 silver grains, troy

• Saddle Material

  brass

• Overall Height

  0.469 inches nominal

• Polarization Type

  off center hole

• Contact Maximum Current Rating In Amps

  1.0

• Terminal Type And Quantity

  4 tab, solder lug

• Contact Material

  beryllium copper

• Saddle Surface Treatment

  nickel

• Projection Length Above Mounting Surface

  0.094 inches nominal

• Precious Material

  gold and silver

• Body Style

  top mount

• Contact Maximum Voltage In Volts And Current Type

  1200.0 ac and 1200.0 dc

• Fabrication Method

  molded

• Body Width

  0.325 inches nominal

• Mounting Method

  terminal

• Mounting Type For Which Designed

  printed circuit

• Precious Material And Location

  contact surfaces gold and contact surfaces silver

• Contact Surface Treatment

  gold and silver

• Accommodated Contact Quantity

  4

• Contact Position Arrangement Style

  irregular

• Terminal Length

  0.188 inches nominal

• Body Diameter

  0.325 inches nominal

• Printed Circuit Board Hole Arrangement Style

  three hole