22YY2019-3

Technical Characteristics

• Accommodated Contact Quantity

  3

• Precious Material And Location

  contact surfaces gold and contact surfaces silver

• Contact Surface Treatment

  gold and silver

• Body Material

  mica

• Polarization Type

  contact position

• Distance Between Mounting Facility Centers

  0.566 inches nominal

• Body Diameter

  0.350 nominal inches

• Specific Equipment Accommodated

  semiconductor device

• Mounting Method

  body through hole

• Contact Position Arrangement Style

  circular irregular 0.200 inch

• Terminal Type And Quantity

  3 wire lead

• Precious Material And Weight

  0.015 gold grains, troy and 0.015 silver grains, troy

• Contact Material

  beryllium copper

• Mounting Hole Style

  two mounting holes/slots, in-line

• Overall Height

  0.266 inches minimum and 0.350 inches maximum

• Precious Material

  gold and silver

• Body Style

  top mount

• Mounting Hole Diameter

  0.094 nominal inches

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded

• Overall Length

  0.758 inches nominal