3BN050S4R7D

Technical Characteristics

• Body Width

  0.050 inches nominal

• Body Height

  0.050 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Body Length

  0.095 inches nominal

• Overall Height (Non-Core)

  0.050 inches maximum

• Overall Width (Non-Core)

  0.050 inches nominal

• Reliability Indicator

  not established

• Dissipation Factor At Reference Temp In Percent

  0.1000

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Capacitance Value Per Section

  4.700 picofarads single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Style

  chip type

• Tolerance Range Per Section

  -0.50/+0.50 picofarads single section

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Overall Length (Non-Core)

  0.095 inches nominal

• Case Material

  ceramic

• Terminal Surface Treatment

  silver

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -25.0/+25.0 single section