EX593

Technical Characteristics

• Accommodated Contact Quantity

  3

• Precious Material

  silver

• Specific Equipment Accommodated

  semiconductor

• Mounting Hole Diameter

  0.113 inches nominal

• Distance Between Mounting Facility Centers

  1.000 inches nominal

• Contact Material

  copper alloy

• Terminal Type And Quantity

  3 solder stud

• Mounting Method

  body through hole

• Contact Position Arrangement Style

  circular irregular 0.141 inch

• Mounting Hole Style

  two mounting holes/slots, in-line

• Precious Material And Location

  contact surface silver

• Body Material

  plastic

• Contact Surface Treatment

  silver

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded