2089272-0702

Technical Characteristics

• Distance From Flatted Portion To Opposite Surface

  0.232 nominal inches

• Precious Material And Location

  contact surfaces gold and contact surfaces silver

• Contact Surface Treatment

  gold and silver

• Accommodated Contact Quantity

  4

• Specific Equipment Accommodated

  semiconductor device

• Features Provided

  component retaining device

• Precious Material And Weight

  0.020 gold grains, troy and 0.020 silver grains, troy

• Mounting Hole Style

  round, flatted

• Polarization Type

  off center hole

• Terminal Type And Quantity

  4 solder stud

• Contact Position Arrangement Style

  rectangular

• Projection Length Above Mounting Surface

  0.062 nominal inches

• Terminal Length

  0.118 inches nominal

• Overall Diameter

  0.312 inches nominal

• Mounting Method

  press fit

• Contact Material

  beryllium copper

• Precious Material

  gold and silver

• Overall Height

  0.430 inches nominal

• Body Material

  plastic

• Body Style

  top mount, press fit

• Mounting Type For Which Designed

  chassis

• Body Mounting Hole Accommodation Diameter

  0.252 inches nominal

• Temp Rating

  225.0 deg celsius

• Fabrication Method

  molded