TISP8736

Semiconductor Devices and Associated Hardware

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TISP8736

5961-00-862-8687

5961 - Semiconductor Devices and Associated Hardware

Texas Instruments Incorporated

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Technical Characteristics

  • Special Features

    junction pattern arrangement: pnp

  • Terminal Type And Quantity

    3 uninsulated wire lead

  • Inclosure Material

    plastic

  • Overall Height

    0.140 inches minimum and 0.160 inches maximum

  • Internal Configuration

    junction contact

  • Joint Electronic Device Engineering Council/Jedec/Case Outline Designation

    t0-220

  • Electrode Internally-Electrically Connected To Case

    collector

  • Mounting Method

    unthreaded hole

  • Voltage Rating In Volts Per Characteristic

    10.0 nominal collector to base voltage/static/emitter open

  • Current Rating Per Characteristic

    500.00 milliamperes maximum collector current, dc

  • Design Control Reference

    802037-001

  • Manufacturers Code

    58634

  • Overall Length

    0.341 inches nominal

  • Overall Width

    0.330 inches minimum and 0.350 inches maximum

  • Mounting Facility Quantity

    1

  • Semiconductor Material

    silicon

  • Power Rating Per Characteristic

    40.0 watts maximum collector power dissipation

  • Maximum Operating Temp Per Measurement Point

    150.0 deg celsius junction

Certified to
AS6081 Methods

Implementing Quality Procurement

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