2089272

Technical Characteristics

• Accommodated Contact Quantity

  3

• Distance From Flatted Portion To Opposite Surface

  0.232 inches nominal

• Polarization Type

  contact position

• Specific Equipment Accommodated

  semiconductor device

• Mounting Method

  press fit

• Contact Surface Treatment

  silver

• Mounting Type For Which Designed

  chassis

• Body Mounting Hole Accommodation Diameter

  0.252 inches nominal

• Fabrication Method

  molded

• Terminal Type And Quantity

  3 tab, solder lug

• Features Provided

  component retaining device

• Contact Material

  copper alloy

• Mounting Hole Style

  round, flatted

• Contact Position Arrangement Style

  circular irregular 0.100 inch