23046-0001

Technical Characteristics

• Precious Material

  silver

• Polarization Type

  contact position

• Specific Equipment Accommodated

  semiconductor device

• Contact Material

  copper alloy

• Body Mounting Hole Accommodation Diameter

  0.362 inches nominal

• Mounting Hole Style

  round, flatted

• Distance From Flatted Portion To Opposite Surface

  0.339 inches nominal

• Precious Material And Location

  contact surfaces silver

• Precious Material And Weight

  0.015 silver grains, troy

• Contact Position Arrangement Style

  circular irregular 0.200 inch

• Terminal Type And Quantity

  3 wire lead

• Contact Surface Treatment

  silver

• Mounting Type For Which Designed

  chassis

• Fabrication Method

  molded

• Accommodated Contact Quantity

  3