BUWEPSDWG2078952

Technical Characteristics

• Fabrication Method

  molded

• Mounting Type For Which Designed

  chassis

• Body Material

  plastic

• Precious Material And Location

  contact surfaces gold

• Mounting Method

  body through hole

• Body Mounting Hole Accommodation Diameter

  0.437 inches nominal

• Contact Surface Treatment

  gold

• Mounting Hole Style

  round, w/double keyway

• Contact Material

  copper alloy

• Terminal Type And Quantity

  3 tab, solder lug

• Precious Material And Weight

  0.015 gold grains, troy

• Specific Equipment Accommodated

  semiconductor

• Polarization Type

  contact position

• Precious Material

  gold

• Accommodated Contact Quantity

  3