32-267189-4
Relays and Solenoids
MODULE CLIP ASSEMBL
32-267189-4
General Dynamics C4 Systems Inc.
MODULE CLIP ASSEMBL
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Technical Characteristics
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General Characteristics Item Description
material of clip is copper-beryllium alloy; finished by electrodeposited cadmium plating; module has components of diodes,13-105281-2,resistor,36-267148-2; top of clip mates with relay,31-267113-1,bottom of clip shall mate with relay socket,73-1006301-2
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