77C707868P1

Technical Characteristics

• Accommodated Contact Quantity

  3

• Precious Material And Location

  contact surfaces gold and contact surfaces silver

• Contact Surface Treatment

  gold and silver

• Overall Diameter

  0.395 inches nominal

• Specific Equipment Accommodated

  semiconductor device

• Distance From Flatted Portion To Opposite Surface

  0.338 nominal inches

• Features Provided

  component retaining device

• Mounting Hole Style

  round, flatted

• Body Mounting Hole Accommodation Diameter

  0.363 inches nominal

• Terminal Type And Quantity

  3 solder stud

• Polarization Type

  off center hole

• Projection Length Above Mounting Surface

  0.062 nominal inches

• Terminal Length

  0.118 inches nominal

• Precious Material And Weight

  0.015 gold grains, troy and 0.015 silver grains, troy

• Mounting Method

  press fit

• Contact Material

  beryllium copper

• Precious Material

  gold and silver

• Overall Height

  0.430 inches nominal

• Body Material

  plastic

• Body Style

  top mount, press fit

• Mounting Type For Which Designed

  chassis

• Temp Rating

  225.0 deg celsius

• Fabrication Method

  molded

• Contact Position Arrangement Style

  triangular