5962010282081

Technical Characteristics

• Test Data Document

  81349-mil-std-883 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• ~1

  data on certain environmental and performanc

• Maximum Power Dissipation Rating

  500.0 milliwatts

• Inclosure Material

  ceramic and glass

• Case Outline Source And Designator

  -0-001-ae joint electron device engineering council

• Features Provided

  monolithic and edge triggered and resettable and high voltage and w/clear and positive outputs and hermetically sealed and w/enable

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  dual 3 input

• End Item Identification

  receiver fscm 50464

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Body Width

  0.240 inches minimum and 0.260 inches maximum

• Output Logic Form

  complementary-metal oxide-semiconductor logic

• Terminal Type And Quantity

  16 printed circuit

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Body Height

  0.095 inches minimum and 0.140 inches maximum

• Voltage Rating And Type Per Characteristic

  -0.5 volts minimum power source and 20.5 volts maximum power source

• Memory Device Type

  rom

• Body Length

  0.745 inches minimum and 0.785 inches maximum

• Terminal Surface Treatment

  solder