0100B7R5KC500

Technical Characteristics

• Body Style

  chip type

• Overall Length

  0.110 inches nominal

• Overall Height

  0.058 inches minimum and 0.102 inches maximum

• Overall Width

  0.055 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Capacitance Value Per Section

  7.500 picofarads single section

• Nonderated Operating Temp

  m55.0 deg celsius minimum and 125.0 deg celsius maximum

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  m20.0/p20.0 single section

• Quality Factor At Reference Temp

  10.0000

• Test Data Document

  81349-mil-c-55681 specification

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Reliability Indicator

  established

• Reliability Failure Rate Level In Percent

  1.0000

• Body Length

  0.110 inches nominal

• Body Width

  0.055 inches nominal

• Body Height

  0.058 inches minimum and 0.102 inches maximum

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Tolerance Range Per Section

  m0.25/p0.25 picofarads single section

• Case Material

  ceramic or glass

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Precious Material And Location

  terminal surface palladium and terminal surface silver

• Precious Material

  palladium and silver

• Terminal Type And Quantity

  2 bonding pad