W050BI102MP1

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Precious Material

  palladium and silver

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  0.1000

• Case Material

  ceramic

• Tolerance Range Per Section

  m5.00/p5.00 percent single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  m30.0/p30.0 single section

• Nonderated Operating Temp

  m55.0 deg celsius minimum and 125.0 deg celsius maximum

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Body Width

  0.050 inches nominal

• Body Length

  0.150 inches nominal

• Overall Width

  0.050 inches nominal

• Overall Length

  0.150 inches nominal

• Reliability Indicator

  not established

• Precious Material And Location

  terminals palladium and terminals silver

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Capacitance Value Per Section

  1000.000 picofarads single section

• Body Height

  0.050 inches maximum

• Overall Height

  0.050 inches nominal

• Terminal Length

  0.020 inches nominal