638-2213-001

Technical Characteristics

• Bit Quantity (Non-Core)

  4096

• Maximum Power Dissipation Rating

  650.0 milliwatts

• Operating Temp Range

  +0.0/+70.0 deg celsius

• Time Rating Per Chacteristic

  70.00 nanoseconds maximum propagation delay time, low to high level output and 70.00 nanoseconds maximum propagation delay time, high to low level output

• Body Height

  0.100 inches minimum and 1.160 inches maximum

• Memory Capacity

  unknown

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Features Provided

  high speed and w/enable and positive outputs and monolithic and hermetically sealed and schottky and 3-state output

• Memory Device Type

  rom

• Terminal Surface Treatment

  solder

• Body Length

  1.188 inches minimum and 1.290 inches maximum

• Inclosure Material

  ceramic and glass

• Inclosure Configuration

  dual-in-line

• Test Data Document

  13499-638-2213 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Input Circuit Pattern

  13 input

• Body Width

  0.515 inches minimum and 0.590 inches maximum

• Terminal Type And Quantity

  24 printed circuit

• Voltage Rating And Type Per Characteristic

  5.5 volts maximum power source

• Word Quantity (Non-Core)

  512

• Output Logic Form

  transistor-transistor logic