DG501AP/883B-2

Technical Characteristics

• Test Data Document

  15942-0213-1-1150-2 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  -55.0/+125.0 deg celsius

• Case Outline Source And Designator

  d-2 mil-m-38510

• Input Circuit Pattern

  8 input

• Features Provided

  negative outputs and positive outputs and monolithic and w/enable

• Body Height

  0.140 inches minimum and 0.185 inches maximum

• Terminal Type And Quantity

  16 printed circuit

• Storage Temp Range

  -65.0/+150.0 deg celsius

• Memory Device Type

  rom

• Body Length

  0.840 inches maximum

• Body Width

  0.220 inches minimum and 0.310 inches maximum

• Terminal Surface Treatment

  solder

• Time Rating Per Chacteristic

  1500.00 nanoseconds maximum propagation delay time, low to high level output and 2500.00 nanoseconds maximum propagation delay time, high to low level output

• Inclosure Material

  ceramic and glass

• Inclosure Configuration

  dual-in-line

• Maximum Power Dissipation Rating

  450.0 milliwatts

• Voltage Rating And Type Per Characteristic

  5.0 volts maximum power source