810AS824

Technical Characteristics

• Word Quantity (Non-Core)

  256

• Maximum Power Dissipation Rating

  1.5 watts

• Output Logic Form

  n-type metal oxide-semiconductor logic

• Operating Temp Range

  +0.0/+85.0 deg celsius

• Body Height

  0.145 inches minimum and 0.175 inches maximum

• Body Length

  2.030 inches minimum and 2.080 inches maximum

• Time Rating Per Chacteristic

  400.00 nanoseconds maximum propagation delay time, low to high level output and 400.00 nanoseconds maximum propagation delay time, high to low level output

• Bit Quantity (Non-Core)

  2048

• Memory Capacity

  unknown

• Memory Device Type

  ram

• Terminal Surface Treatment

  solder

• Features Provided

  high speed and w/enable and programmable and resettable and hermetically sealed and monolithic and positive outputs and 3-state output

• Voltage Rating And Type Per Characteristic

  7.0 volts maximum power source

• Inclosure Material

  ceramic and glass

• Storage Temp Range

  -55.0/+125.0 deg celsius

• Terminal Type And Quantity

  40 printed circuit

• Test Data Document

  30003-810as824 drawing (this is the basic governing drawing, such as a contractor drawing, original equipment manufacturer drawing, etc.; excludes any specification, standard or other document that may be referenced in a basic governing drawing)

• Inclosure Configuration

  dual-in-line

• Input Circuit Pattern

  14 input

• Body Width

  0.515 inches minimum and 0.600 inches maximum