100B181JP

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.110 inches nominal

• Precious Material And Location

  terminals silver

• Body Length

  0.140 inches maximum

• Features Provided

  hermetically sealed case

• Dissipation Factor At Reference Temp In Percent

  0.0100

• Reliability Indicator

  not established

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  300.0 dc single section

• Tolerance Range Per Section

  -2.00/+2.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Case Material

  glass

• Body Height

  0.100 inches maximum

• Quality Factor At Reference Temp

  10000.0000

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Overall Height (Non-Core)

  0.100 inches maximum

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Precious Material (Non-Core)

  silver

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Capacitance Value Per Section

  180.000 picofarads single section

• Overall Length (Non-Core)

  0.140 inches maximum

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Body Style

  chip type

• Overall Width (Non-Core)

  0.110 inches nominal