582R069H13

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Dissipation Factor At Reference Temp In Percent

  2.5000

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Case Material

  ceramic or glass

• Voltage Temp Limits Per Section In Percent Capacitance Change

  m15.0/p15.0 without voltage applied single section

• Capacitance Value Per Section

  3900.000 picofarads single section

• Insulation Resistance At Maximum Operating Temp

  10000.0 megohms

• Body Width

  0.050 inches nominal

• Body Length

  0.080 inches nominal

• Overall Width

  0.050 inches nominal

• Overall Height

  0.055 inches nominal

• Terminal Length

  0.020 inches nominal

• Overall Length

  0.080 inches nominal

• Reliability Indicator

  not established

• Terminal Surface Treatment

  solder

• Tolerance Range Per Section

  m10.00/p10.00 percent single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Nonderated Operating Temp

  m55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Height

  0.055 inches nominal