161502-221

Technical Characteristics

• Test Data Document

  81349-mil-c-55681 specification (includes engineering type bulletins, brochures,etc., that reflect specification type data in specification format; excludes commercial catalogs, industry directories, and similar trade publications, reflecting general type

• Reliability Failure Rate Level In Percent

  1.0000

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Overall Height (Non-Core)

  0.102 inches maximum

• Body Style

  chip type

• Overall Width (Non-Core)

  0.110 inches nominal

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Body Length

  0.110 inches nominal

• Case Material

  ceramic

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.110 inches nominal

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Reliability Indicator

  established

• Terminal Surface Treatment

  solder

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  220.000 picofarads single section

• Body Height

  0.102 inches maximum

• Nonderated Continuous Voltage Rating And Type Per Section

  200.0 dc single section

• Overall Length (Non-Core)

  0.110 inches nominal

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• ~1

  data on certain environmental and performanc