SA1060-685

Technical Characteristics

• Overall Width (Non-Core)

  0.095 inches nominal

• Terminal Type And Quantity

  2 bonding pad

• Body Width

  0.095 inches nominal

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -30.0/+30.0 single section

• Body Height

  0.065 inches maximum

• Reliability Indicator

  not established

• Capacitance Value Per Section

  470.000 picofarads single section

• Tolerance Range Per Section

  -2.00/+2.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Precious Material And Location

  terminal surfaces silver

• Nonderated Continuous Voltage Rating And Type Per Section

  200.0 dc single section

• Dissipation Factor At Reference Temp In Percent

  0.1500

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  0.0 single section

• Body Style

  chip type

• Body Length

  0.125 inches nominal

• Overall Height (Non-Core)

  0.065 inches maximum

• Precious Material (Non-Core)

  silver

• Case Material

  ceramic

• Overall Length (Non-Core)

  0.125 inches nominal