ULA755A271K

Technical Characteristics

• Overall Width

  0.050 inches minimum and 0.070 inches maximum

• Terminal Type And Quantity

  2 bonding pad

• Capacitance Value Per Section

  270.000 picofarads single section

• Nonderated Continuous Voltage Rating And Type Per Section

  100.0 dc single section

• Body Height

  0.150 inches nominal

• Terminal Surface Treatment

  solder

• Reliability Indicator

  not established

• Tolerance Range Per Section

  -2.00/+2.00 percent single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Body Width

  0.050 inches minimum and 0.070 inches maximum

• Insulation Resistance At Reference Temp

  100000.0 megohms

• Schematic Diagram Designator

  no common or grounded electrode(s)

• Dissipation Factor At Reference Temp In Percent

  0.6000

• Terminal Length

  0.030 inches nominal

• Overall Height (Non-Core)

  0.150 inches nominal

• Body Style

  chip type

• Overall Length (Non-Core)

  0.160 inches nominal

• Case Material

  ceramic

• Voltage Temp Limits Per Section In Percent Capacitance Change

  -7.5/+7.5 without voltage applied single section

• Body Length

  0.160 inches nominal