ATC100B620JP500X

Technical Characteristics

• Reliability Failure Rate Level In Percent

  1.0000

• Body Height

  0.102 inches maximum

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Iii Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0 to 20.0 single section

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Iii Terminal Surface Treatment

  silver or palladium

• (Non-Core Data) Precious Material

  palladium or silver

• Manufacturers Code

  81349

• Non-Definitive Government Spec/Std Reference

  mil-c-55681/4

• Test Data Document

  81349-mil-c-55681 specification

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Body Style

  45a chip type

• Reliability Indicator

  established

• (Non-Core Data) Overall Length

  0.110 inches nominal

• (Non-Core Data) Overall Height

  0.102 inches maximum

• (Non-Core Data) Overall Width

  0.110 inches nominal

• Body Length

  0.110 inches nominal

• Body Width

  0.110 inches nominal

• Capacitance Value Per Section

  62.000 picofarads single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Nonderated Continuous Voltage Rating And Type Per Section

  500.0 dc single section

• Tolerance Range Per Section

  -1.00 to 1.00 percent single section

• Case Material

  ceramic

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Iii Precious Material And Location

  terminal surfaces palladium or terminal surfaces silver

• Definitive Government Spec/Std Reference

  cdr13bg620efmm

• Terminal Type And Quantity

  2 bonding pad