MIL-C-55681/4

Technical Characteristics

• Terminal Type And Quantity

  2 bonding pad

• Test Data Document

  81349-mil-c-55681 specification

• Terminal Surface Treatment

  solder

• Dissipation Factor At Reference Temp In Percent

  0.0500

• Insulation Resistance At Reference Temp

  1000000.0 megohms

• Case Material

  ceramic or glass

• Nonderated Continuous Voltage Rating And Type Per Section

  50.0 dc single section

• Insulation Resistance At Maximum Operating Temp

  100000.0 megohms

• Schematic Diagram Designator

  1c no common or grounded electrode(s)

• Center To Center Distance Between Terminals Parallel To Length

  0.035 inches nominal

• Body Height

  0.028 inches minimum and 0.057 inches maximum

• Overall Height

  0.028 inches minimum and 0.057 inches maximum

• Reliability Failure Rate Level In Percent

  1.0000

• Reliability Indicator

  established

• Body Style

  45a chip type

• Body Length

  0.055 inches nominal

• Overall Width

  0.055 inches nominal

• Terminal Length

  0.010 inches nominal

• Overall Length

  0.055 inches nominal

• Specification/Standard Data

  81349-mil-c-55681/4 government specification

• Quality Factor At Reference Temp

  3200.0000

• Tolerance Range Per Section

  -1.00/+1.00 percent single section

• Tolerance Of Temp Coefficient Per Section In Ppm Per Deg Celsius

  -20.0/+20.0 single section

• Temp Coefficient Of Capacitance Per Section In Ppm Per Deg Celsius

  90.0 single section

• Nonderated Operating Temp

  -55.0 deg celsius minimum and 125.0 deg celsius maximum

• Capacitance Value Per Section

  100.000 picofarads single section

• Body Width

  0.055 inches nominal